Japan’s OKI Circuit Technology, the OKI Group PCB company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs, the company said in a media release. OTC is seeking to establish mass production technology by October 2025 at its Joetsu plant in Niigata Prefecture, which has a proven track record and advanced development and production capabilities in the field of high multilayer, high-precision, large-format PCBs for semiconductor inspection equipment. Since the latest semiconductors process an enormous number of signals and the number of wafer-mounted chips increases due to process miniaturization, it is necessary to increase density and more layers on the PCBs used in inspection equipment. Nevertheless, PCB thickness has been limited to 7.6 mm due to various constraints, and 108 layers was the maximum limit with conventional technology. OKI developed ultra-thin materials and tools, along with a proprietary automatic transport system, enabling the production of 124-layer PCBs with a board thickness of 7.6 mm. OKI emphasizes that this breakthrough was achieved through handling technologies suitable for ultra-thin materials, which were incorporated into its production line. The company’s efforts are targeted towards future growth sectors, including AI semiconductors, aerospace, defense, robotics, and next-generation communications, reflecting its focus on technological innovation and comprehensive manufacturing services. Industry events such as the upcoming Evertiq Expo in Malmö, Sweden, on May 15, 2025, offer a platform for industry stakeholders to explore these advancements and connect with leaders shaping the future of electronics.
