Introduction

From September 10-12, 2024, MSquare Technology made a notable appearance at the AI Hardware & Edge AI Summit in San Jose. With over 1,500 attendees and more than 75 industry-leading speakers, the event was a prime platform for MSquare to showcase its cutting-edge semiconductor IP and Chiplet solutions.

Pushing the Boundaries

MSquare is at the forefront of innovation in interconnect IP and Chiplet solutions. Their IO Die ML100 is a high-bandwidth memory solution, integrating efficient Die-to-Die interconnect IP and supporting the UCIe 1.1 protocol. This enables ultra-fast data transfer and low-latency inter-chip communication, significantly enhancing AI model training and inference.

Diverse Product Portfolio

MSquare has established a robust IP product portfolio, validated and mass-produced across various process nodes, supporting over 400 different process technologies. Their offerings include high-speed interconnect IPs like HBM, LPDDR, and PCIe, alongside advanced Chiplet solutions such as the M2LINK platform.

Global Expansion

MSquare is expanding globally, with strategic hubs in San Jose, Sydney, and Tokyo. The summit provided an opportunity for MSquare to demonstrate its technological prowess and foster collaboration with industry leaders.

Looking Ahead

As AI and edge computing technologies evolve rapidly, MSquare remains committed to leading in interconnect IP and Chiplet innovation. Their participation in the summit underscores their dedication to pushing technological boundaries and shaping the future of AI.

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